IMS3TW 2011 - Call for Papers

CALL FOR PAPERS

Scope -- Submissions -- Key Dates -- Additional Information -- Committees

Scope

The rapid pervasion of micro/nanoelectronics into various application fields like biology, chemistry, mechanics, optics, etc. is fostering unprecedented types of heterogeneous integrated systems and associated interfaces between these previously largely separate domains. Microsystems that combine advanced sensors and actuators with embedded, high-performance microprocessors are enabling an endless list of new applications in life sciences, aerospace, the environment, communications, etc. The design and test of such heterogeneous systems presents formidable challenges. In particular, as the inherent quality and reliability of the fundamental building blocks generally decreases with scale, the number of test and design-for-test, diagnosability, -manufacturability, -reliability considerations grows rapidly and their importance soars. The test of such systems is a multidimensional challenge that grows in criticality with increased levels of integration. Test requirements often only implied that individual or multiple signals of a specific nature needed to be observed or monitored. For heterogeneous systems, a mixture of different types of signals observed and/or monitored at different levels of integration or packaging, will need to be the focus of test procedures, for both low and high volume levels of production. In addition to the mixture of signals, a mixture of processes will need to be developed to encompass signal sensing, conversion and conditioning. Reliability assessment and external and/or self-diagnosis and -repair will become critical facets of such systems.

Seventeen years ago, the IEEE Mixed-Signal Test Workshop (IMSTW) was inaugurated as a forum focused on test and design issues related to electronic systems with digital and analog components. In view of accelerated developments in heterogeneous system design and production, IMSTW was expanded in 2008 to include new topics that address test, design for test, reliability and manufacturability of today’s sensors and sensor-based systems, as well as emerging devices and systems. Renamed to include sensors and systems, IMS3TW aims to bring together a community of researchers working on the next-generation of devices, circuits and systems. This year, IMS3TW will continue to address the traditional technology spectrum of IMSTW, in particular all aspects of analog, mixed-signal, and RF testing, but with increased attention to all aspects of current design complexity (e.g., parametric variability, power consumption, temperature effects). To guaranteeing design robustness for the new generation of nanoelectronic devices, we need to exploit self-monitoring functionality (such as self-test/-calibration), allowing the circuit or system to adapt to varying circuit parameters or functional demands. The sensors focus of the workshop will highlight all aspects of built-in sensors for device adaptation, MEMS, and biomedical applications such as lab-on-chip and implantable devices.

Primary Topics of Interest include:

Test & Design for (on/off-line) Test
Reliability & Design for Reliability
Fault and Error Modelling & Simulation

Verification & Design for Verification
Monitoring/Diagnosis & Design for Debug/Diagnosis
Fault Tolerance

Pertaining to the following systems or underlying technologies:

Analog/Mixed-Signal Circuits
Biomedical Circuits & Systems
RF & Wirelessly Controlled Devices
Optoelectronics & Photonics
Drug Delivery Microsystems

Lab-on-Chip
MEMS
Microfluidics
Heterogeneous Systems
Implantable Devices

Submissions

top

Prospective authors are invited to submit papers on the topics of interest. Submissions should be via the workshop web-site and consist of either an extended summary of at least 750 words or a full paper. The accepted papers will be published in an IEEE Computer Society Proceedings available on the IEEE digital library (EXPLORE).

Key Dates

top

Submission deadline: January 31, 2011
Notification of acceptance: March 16, 2011
Final copy deadline: April 21, 2011

Additional Information

top

General Information
K.-T. Tim Cheng
Department of Electrical and Computer Engineering
University of California
Santa Barbara, CA 93106, USA
Tel.: 1-805-893-7294
E-mail: timcheng@ece.ucsb.edu

Program Information
David Keezer
School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta, GA 30332, USA
Tel.: 1-404-894-4741
E-mail: david.keezer@ece.gatech.edu

Committees

top

General Chair
K.-T. Cheng, UCSB, USA

General Co-Chairs
J.-L. Huang, National Taiwan U., Taiwan
B. Kaminska, SFU, Canada

Program Committee Chair
David Keezer, Georgia Tech, USA

Program Co-Chairs
Signals & Systems:
H. Stratigopoulos, TIMA, France
Sensors:
S. Bhunia, Case Western Res. U., USA

Panel Chair
K. Chakrabarty, Duke U., USA

New Initiatives Chair
B. Courtois, CMP, France

Special Session Chair
I. McWalker, CMC Microsystems, Canada

Publicity Chair
S. Mir, TIMA, France

Publications Chair
TBD

TTTC Liaison
A. Ivanov, UBC, Canada

Local Arrangements Chair
H.-M. Chang, UCSB, USA

For more information, visit us on the web at: http://cadlab.ece.ucsb.edu/IMS3TW2011/

The International Mixed-Signals, Sensors, and Systems Test Workshop (IMS3TW’11) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).